• DocumentCode
    1972237
  • Title

    Adjacent line coupling for long off chip interconnects

  • Author

    Harrer, Hubert ; Kaller, Dierk ; Klink, Erich

  • Author_Institution
    IBM Deutschland Entwicklung GmbH GmbH, Boeblingen, Germany
  • fYear
    1997
  • fDate
    27-29 Oct. 1997
  • Firstpage
    139
  • Lastpage
    141
  • Abstract
    The paper describes the coupling effects from adjacent lines for different types of material. The impact of high frequency effects will be shown for long board lines, which reduces the coupling noise. A typical off chip net structure of an S/390 computer system is examined and the attenuation effect is discussed for frequency dependent model parameters of the R, L and G values. Also the importance of the signal to power ratio for via structures and connectors will be demonstrated for several examples. Multiple cycle impacts are shown if reflections of the active signals coincide with the subsequent cycle. Finally, a comparison of the timing impact is given for thinfilm, standard ceramic, glass ceramic and FR4 board lines.
  • Keywords
    integrated circuit interconnections; integrated circuit noise; FR4 board; S/390 computer system; active signal reflection; adjacent line coupling; attenuation; connector; glass ceramic board; high frequency effects; multiple cycle; net structure; noise; off chip interconnect; signal to power ratio; standard ceramic board; thin film board; timing; via; Circuit noise; Connectors; Coupling circuits; Frequency; Integrated circuit interconnections; Noise reduction; Packaging; Reflection; Timing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-8649-3
  • Type

    conf

  • DOI
    10.1109/EPEP.1997.634057
  • Filename
    634057