DocumentCode
1972237
Title
Adjacent line coupling for long off chip interconnects
Author
Harrer, Hubert ; Kaller, Dierk ; Klink, Erich
Author_Institution
IBM Deutschland Entwicklung GmbH GmbH, Boeblingen, Germany
fYear
1997
fDate
27-29 Oct. 1997
Firstpage
139
Lastpage
141
Abstract
The paper describes the coupling effects from adjacent lines for different types of material. The impact of high frequency effects will be shown for long board lines, which reduces the coupling noise. A typical off chip net structure of an S/390 computer system is examined and the attenuation effect is discussed for frequency dependent model parameters of the R, L and G values. Also the importance of the signal to power ratio for via structures and connectors will be demonstrated for several examples. Multiple cycle impacts are shown if reflections of the active signals coincide with the subsequent cycle. Finally, a comparison of the timing impact is given for thinfilm, standard ceramic, glass ceramic and FR4 board lines.
Keywords
integrated circuit interconnections; integrated circuit noise; FR4 board; S/390 computer system; active signal reflection; adjacent line coupling; attenuation; connector; glass ceramic board; high frequency effects; multiple cycle; net structure; noise; off chip interconnect; signal to power ratio; standard ceramic board; thin film board; timing; via; Circuit noise; Connectors; Coupling circuits; Frequency; Integrated circuit interconnections; Noise reduction; Packaging; Reflection; Timing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location
Austin, TX
Print_ISBN
0-7803-8649-3
Type
conf
DOI
10.1109/EPEP.1997.634057
Filename
634057
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