Title :
Effects of heat spreader on electrical characteristics of tape-BGA packages
Author :
Hasan, Samil ; Cangellaris, Andreas ; Kaw, Ravi ; Pinello, William
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
Heat spreader is an integral part of a high speed integrated circuit (IC) package. It affects electrical characteristics of interconnects and the radiation behavior of a given package. This paper investigates these effects using several tools developed at the University of Arizona.
Keywords :
cooling; electromagnetic interference; integrated circuit packaging; IC packaging; electrical characteristics; heat spreader; high speed integrated circuit; radiation behavior; Electric variables; Electronics packaging; Frequency; High speed integrated circuits; Inductance; Integrated circuit interconnections; Integrated circuit packaging; Research and development; Resistance heating; Skin effect;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634060
