Title :
A novel soft error immunity SRAM cell
Author :
Xuemei Liu ; Liyang Pan ; Xin Zhao ; Fengying Qiao ; Dong Wu ; Jun Xu
Author_Institution :
Inst. of Microelectron. Tsinghua Univ., Beijing, China
Abstract :
The scaling down of the technology node makes integrated circuits more susceptible to soft errors, normally caused by radiation strike. In this paper, we propose a novel Soft Error Immunity (SEI) SRAM cell using a standard 65nm CMOS process, which has good tolerance to soft errors, especially at read state. SPICE simulation results show that the proposed cell is robust to the variation of process, voltage and temperature. Extensive 3-D technology computer-aided design (TCAD) simulation analyses show that the proposed cell can recover the upset-state.
Keywords :
CMOS memory circuits; SPICE; SRAM chips; circuit simulation; radiation hardening (electronics); technology CAD (electronics); 3D technology computer-aided design simulation; CMOS process; SPICE simulation; TCAD simulation; process variation; read state; size 65 nm; soft error immunity SRAM cell; soft error upset; MOS devices; Robustness; SRAM cells; Solid modeling; Standards; Transistors; SRAM; soft error immunity (SEI); soft error upset (SEU);
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International
Conference_Location :
South Lake Tahoe, CA
Print_ISBN :
978-1-4799-0350-4
DOI :
10.1109/IIRW.2013.6804187