Title :
Microvia Fill Ratio Control
Author :
Tenno, Robert ; Pohjoranta, Antti
Author_Institution :
Helsinki Univ. of Technol., Espoo
Abstract :
A control law for microvia fill process optimization is proposed in this paper. The law enables linear growth of either microvia fill ratio by applying nonlinear control of cell voltage or plating current density, implemented as a set point trajectory for a potentiostat or galvanostat, respectively. Linear deposit growth enables accurate prediction of plating duration and end time. The control system is simulated and compared with results of via fill tests.
Keywords :
electroplating; integrated circuit interconnections; printed circuits; semiconductor process modelling; cell voltage; linear deposit growth; microvia fill ratio control; nonlinear control; plating current density; plating duration; process optimization; Additives; Cathodes; Chemical processes; Chemistry; Circuit testing; Copper; Current density; Electric variables control; Microscopy; Voltage;
Conference_Titel :
Industrial Electronics, 2007. ISIE 2007. IEEE International Symposium on
Conference_Location :
Vigo
Print_ISBN :
978-1-4244-0754-5
Electronic_ISBN :
978-1-4244-0755-2
DOI :
10.1109/ISIE.2007.4374590
