Title :
Accurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors
Author :
Sercu, Stefaan ; Martens, Luc
Author_Institution :
Dept. of Inf. Technol., Ghent Univ., Belgium
Abstract :
This paper investigates the determination of the intrinsic high-frequency characteristics of a multi-pin backplane connector. The intrinsic characteristics are the characteristics (S-parameters) of the connector without the presence of a component board or a backplane on which it must be mounted. The connector model, which is independent of the connector via holes, can be used in system simulations with arbitrary component boards and backplanes.
Keywords :
S-parameters; electric connectors; microwave measurement; printed circuit accessories; printed circuit testing; S-parameters; connector model; de-embedding; high-frequency characteristics; multi-pin backplane connector; system simulations; test boards; via holes; Backplanes; Calibration; Coaxial components; Connectors; Contacts; Fixtures; Frequency measurement; Probes; Scattering parameters; Testing;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634065
