Title :
Measurement and field simulation based characterization of plastic IC packages
Author_Institution :
Budapest Design Office, Austria Mikro Syst. Int. AG, Hungary
Abstract :
A method to obtain electrical models for IC packages is introduced. We used measured S-parameters to extract equivalent circuits for the package and surrounding components. The resulted equivalent circuit was verified with 3D field simulation.
Keywords :
S-parameters; equivalent circuits; integrated circuit modelling; integrated circuit packaging; plastic packaging; 3D field simulation; S-parameters measurement; electrical model; equivalent circuit; plastic IC package; Bonding; Capacitance; Circuit testing; Coupling circuits; Equivalent circuits; Integrated circuit modeling; Pins; Plastic integrated circuit packaging; Scattering parameters; Semiconductor device measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634066
