Title :
Simulation of large packaged dense microwave circuits
Author :
Petre, Peter ; Valley, George C. ; Kihm, Robert T. ; Gedney, Steplieit D.
Author_Institution :
Hughes Res. Labs., Malibu, CA, USA
Abstract :
A new fast method of moments code is used to predict the performance and calculate the electromagnetic properties of packaged, dense, planar microwave circuits. It is demonstrated that circuits as large as transmit/receive (T/R) modules that cannot be simulated accurately with commercial tools can be modeled with this method.
Keywords :
circuit analysis computing; method of moments; microwave circuits; packaging; transceivers; electromagnetic properties; large packaged dense planar microwave circuit; method of moments; simulation; transmit/receive module; Circuit simulation; Circuit testing; Electromagnetic coupling; Electromagnetic scattering; Electromagnetic waveguides; Electronics packaging; Equivalent circuits; Filters; Integrated circuit interconnections; Microwave circuits;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634068
