Title :
A novel broadband flip chip interconnection
Author :
Kim, Juno ; Koh, Dongsoo ; Itoh, Tatsuo
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Abstract :
Flip chip interconnections with CPW structures are studied. A novel broadband flip chip interconnection design is proposed based on the results of the sensitivity analysis performed by the Finite Difference Time Domain (FDTD) method.
Keywords :
coplanar waveguides; finite difference time-domain analysis; flip-chip devices; integrated circuit interconnections; sensitivity analysis; CPW; FDTD method; broadband flip chip interconnection design; sensitivity analysis; Bonding; Conductors; Finite difference methods; Flip chip; Frequency; Integrated circuit interconnections; Joining processes; Sensitivity analysis; Time domain analysis; Wire;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634070
