• DocumentCode
    1973393
  • Title

    A novel broadband flip chip interconnection

  • Author

    Kim, Juno ; Koh, Dongsoo ; Itoh, Tatsuo

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
  • fYear
    1997
  • fDate
    27-29 Oct. 1997
  • Firstpage
    199
  • Lastpage
    202
  • Abstract
    Flip chip interconnections with CPW structures are studied. A novel broadband flip chip interconnection design is proposed based on the results of the sensitivity analysis performed by the Finite Difference Time Domain (FDTD) method.
  • Keywords
    coplanar waveguides; finite difference time-domain analysis; flip-chip devices; integrated circuit interconnections; sensitivity analysis; CPW; FDTD method; broadband flip chip interconnection design; sensitivity analysis; Bonding; Conductors; Finite difference methods; Flip chip; Frequency; Integrated circuit interconnections; Joining processes; Sensitivity analysis; Time domain analysis; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-8649-3
  • Type

    conf

  • DOI
    10.1109/EPEP.1997.634070
  • Filename
    634070
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1973393