Simulation and performance of passive microwave and millimeter wave coplanar waveguide circuit devices with flip chip packaging

Author

Petre, P. ; Matloubian, M. ; Kihm, R.T. ; Gedney, S.D.

Author_Institution

Hughes Res. Labs., Malibu, CA, USA

fYear

1997

fDate

27-29 Oct. 1997

Firstpage

203

Lastpage

206

Abstract

This paper presents a descriptive study of the design and modeling of grounded coplanar waveguide (GCPW) and finite ground coplanar waveguide (FGCPW) circuits for microwave and millimeter wave applications. It is demonstrated that FGCPWs have a number of advantages over GCPW and microstrip, including that it easily accommodates flip chip packaging. It is also demonstrated that full-wave electromagnetic analysis tools can be used effectively to reduce the design cycle time of practical microwave circuit devices.

Keywords

circuit analysis computing; coplanar waveguides; flip-chip devices; integrated circuit packaging; microwave integrated circuits; millimetre wave integrated circuits; passive networks; design; finite ground coplanar waveguide; flip chip packaging; full-wave electromagnetic analysis; grounded coplanar waveguide; microwave circuit; millimeter wave circuit; modeling; passive coplanar waveguide device; simulation; Circuit simulation; Coplanar waveguides; Electromagnetic analysis; Electromagnetic waveguides; Flip chip; Microstrip; Microwave circuits; Microwave devices; Millimeter wave circuits; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on

Conference_Location

Austin, TX

Print_ISBN

0-7803-8649-3

Type

conf

DOI

10.1109/EPEP.1997.634071

Filename

634071