Title :
Buried double bondwires for microwave hermetic packages
Author :
Kim, Sung-Jin ; Lee, Hai-Young
Author_Institution :
Sch. of Electr. & Electron. Eng., Ajou Univ., Suwon, South Korea
Abstract :
Double bondwires buried in a dielectric material is proposed for high frequency hermetic packages and characterized experimentally and theoretically up to 30 GHz. These buried bondwires made it possible to achieve 15 dB improvement of return loss at 20 GHz compared to conventional bondwires.
Keywords :
integrated circuit packaging; lead bonding; microwave integrated circuits; 20 to 30 GHz; buried double bondwire; dielectric material; microwave hermetic package; return loss; Bonding; Dielectric measurements; Electronics packaging; Frequency; Insertion loss; MMICs; Message-oriented middleware; Microwave devices; Scattering parameters; Testing;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634072
