Title :
Ultra low loss millimeter wave MCM interconnects
Author :
Pham, A. ; Laskar, J. ; Krishnamurthy, V. ; Cole, H.S. ; Sitnik-Nieters, T.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We present the design and development of ultra low loss and high density organic interconnect packaging technology at millimeter wave frequencies. Various microstrip passive components have been designed and characterized to demonstrate that the high density organic interconnect approach is suitable for W-band (75 GHz-110 GHz) packaging. The loss of the organic interconnects has been found to be comparable with that of microstrip lines on alumina substrates at W-band frequencies.
Keywords :
integrated circuit interconnections; losses; microstrip components; millimetre wave circuits; multichip modules; 75 to 110 GHz; W-band; microstrip passive components; millimeter wave MCM interconnects; organic interconnect packaging technology; ultra-low loss interconnects; Ceramics; Coplanar waveguides; Dielectric films; Dielectric losses; Frequency; Microstrip; Millimeter wave technology; Multichip modules; Packaging; Trademarks;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634073
