DocumentCode
1974035
Title
Ultra low loss millimeter wave MCM interconnects
Author
Pham, A. ; Laskar, J. ; Krishnamurthy, V. ; Cole, H.S. ; Sitnik-Nieters, T.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
1997
fDate
27-29 Oct. 1997
Firstpage
213
Lastpage
216
Abstract
We present the design and development of ultra low loss and high density organic interconnect packaging technology at millimeter wave frequencies. Various microstrip passive components have been designed and characterized to demonstrate that the high density organic interconnect approach is suitable for W-band (75 GHz-110 GHz) packaging. The loss of the organic interconnects has been found to be comparable with that of microstrip lines on alumina substrates at W-band frequencies.
Keywords
integrated circuit interconnections; losses; microstrip components; millimetre wave circuits; multichip modules; 75 to 110 GHz; W-band; microstrip passive components; millimeter wave MCM interconnects; organic interconnect packaging technology; ultra-low loss interconnects; Ceramics; Coplanar waveguides; Dielectric films; Dielectric losses; Frequency; Microstrip; Millimeter wave technology; Multichip modules; Packaging; Trademarks;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location
Austin, TX
Print_ISBN
0-7803-8649-3
Type
conf
DOI
10.1109/EPEP.1997.634073
Filename
634073
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