Title :
Circuit modeling of isolation in flip-chip microwave integrated circuits
Author :
Ito, Ryosuke ; Jackson, Robert W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
Abstract :
A circuit model for multi-port flipped-chip packaging of microwave integrated circuits is described. The model topology includes the effect of non-ideal isolation between IC ports and predicts resonance behavior in the millimeterwave range. Measurements of a scale model four port are used for verification.
Keywords :
MIMIC; flip-chip devices; integrated circuit modelling; integrated circuit packaging; multiport networks; IC ports; circuit model; flip-chip microwave integrated circuits; millimeterwave range; multi-port flipped-chip packaging; nonideal isolation; resonance behavior; scale model four port; Circuit simulation; Circuit testing; Circuit topology; Frequency; Integrated circuit measurements; Integrated circuit modeling; MMICs; Microwave integrated circuits; Packaging; Semiconductor device measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634074
