DocumentCode :
1974362
Title :
Dynamic Thermal Management for system-on-chip using bus arbitration
Author :
Srivathsa, Sudheendra K ; Suresh, Vikram B. ; Panchapakeshan, Pavan ; Kundu, Sandip
Author_Institution :
Electr. & Comput. Eng., Univ. of Massachusetts, Amherst, MA, USA
fYear :
2010
fDate :
22-23 Nov. 2010
Firstpage :
372
Lastpage :
375
Abstract :
Increasing on-chip temperature in SoC designs has reinforced the need for Dynamic Thermal Management (DTM). The conventional DTM techniques adopted in microprocessors based on DVFS are not suitable in the context of SoCs as they tend to have multiple voltage and frequency domains. In this paper we propose a reactive and a predictive DTM technique using bus arbitration. Based on the thermal profile the bus grants and hence the bus transactions are controlled. This regulates the data flow which reduces the activity in the functional units. The results show that the on-chip temperature can be maintained 3-5°C below the chip temperature threshold with a worst case performance penalty of 5% and a fast response time of at most 5 clock cycles. The hardware cost of implementing the proposed scheme is 3619.7μm2 in 45 nm technology, which is less than 0.06% of the chip area. Apart from its simplicity, lower cost and effectiveness, the solution is non-intrusive on the design and scalable to many cores.
Keywords :
integrated circuit design; system-on-chip; thermal management (packaging); DVFS; SoC designs; bus arbitration; chip temperature threshold; data flow; dynamic thermal management; frequency domains; microprocessors; on-chip temperature; predictive DTM technique; reactive DTM techniques; size 45 nm; system-on-chip; temperature 3 degC to 5 degC; Clocks; Computer architecture; System-on-a-chip; Temperature sensors; Thermal management; Time factors; Arbiter; Bus; Dynamic Thermal Management; SoC;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SoC Design Conference (ISOCC), 2010 International
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-8633-5
Type :
conf
DOI :
10.1109/SOCDC.2010.5682894
Filename :
5682894
Link To Document :
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