DocumentCode
1974674
Title
Application of Magnetic Field-Circuit Coupling Efficiency Analysis for SiP Power Module
Author
Kawashima, Tetsuya ; Mishima, Akira
Author_Institution
Hitachi Ltd., Hitachi
fYear
2007
fDate
4-7 June 2007
Firstpage
629
Lastpage
632
Abstract
In this paper, we present an analysis method which couples magnetic field analysis and circuit analysis for simulating power modules. Parasitic impedance and MOSFET devices were modeled for SPICE simulation. We applied the simulation to a system in package (SiP) power module and showed that efficiency and voltage waveform could be calculated with high accuracy.
Keywords
SPICE; magnetic fields; network analysis; power MOSFET; system-in-package; MOSFET devices; SPICE simulation; circuit analysis; coupling efficiency analysis; magnetic field analysis; parasitic impedance; power modules; system in package power module; Analytical models; Circuit analysis; Circuit simulation; Coupling circuits; Impedance; MOSFET circuits; Magnetic analysis; Magnetic fields; Multichip modules; Power system modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics, 2007. ISIE 2007. IEEE International Symposium on
Conference_Location
Vigo
Print_ISBN
978-1-4244-0754-5
Electronic_ISBN
978-1-4244-0755-2
Type
conf
DOI
10.1109/ISIE.2007.4374669
Filename
4374669
Link To Document