Title :
Application of Magnetic Field-Circuit Coupling Efficiency Analysis for SiP Power Module
Author :
Kawashima, Tetsuya ; Mishima, Akira
Author_Institution :
Hitachi Ltd., Hitachi
Abstract :
In this paper, we present an analysis method which couples magnetic field analysis and circuit analysis for simulating power modules. Parasitic impedance and MOSFET devices were modeled for SPICE simulation. We applied the simulation to a system in package (SiP) power module and showed that efficiency and voltage waveform could be calculated with high accuracy.
Keywords :
SPICE; magnetic fields; network analysis; power MOSFET; system-in-package; MOSFET devices; SPICE simulation; circuit analysis; coupling efficiency analysis; magnetic field analysis; parasitic impedance; power modules; system in package power module; Analytical models; Circuit analysis; Circuit simulation; Coupling circuits; Impedance; MOSFET circuits; Magnetic analysis; Magnetic fields; Multichip modules; Power system modeling;
Conference_Titel :
Industrial Electronics, 2007. ISIE 2007. IEEE International Symposium on
Conference_Location :
Vigo
Print_ISBN :
978-1-4244-0754-5
Electronic_ISBN :
978-1-4244-0755-2
DOI :
10.1109/ISIE.2007.4374669
