DocumentCode
1974780
Title
Using active IF load-pull to investigate electrical base-band induced memory effects in high-power LDMOS transistors
Author
Alghanim, Abdulrahman ; Lees, Jonathan ; Williams, Tudor ; Benedikt, Johannes ; Tasker, Paul
Author_Institution
Dept of Electr. & Electron. Eng., Cardiff Univ., Cardiff
fYear
2007
fDate
11-14 Dec. 2007
Firstpage
1
Lastpage
4
Abstract
Memory effects are generally attributable to thermal, electrical, packaging and/ or surface effects. This behaviour in turn impacts overall linearity and importantly the suitability of a power amplifier (PA) to linearisation through pre-distortion. It is assumed that electrical memory introduced by the low-frequency baseband impedance environments associated with the power amplifier bias insertion networks being frequency dependent represents a significant contributor to overall observed memory effects in high-power LDMOS PA design. In this work, baseband or IF active load-pull is used to provide an effective way to engineer all the significant IF components generated as a result of multi-tone excitation, independent of modulation frequency. Specific IF impedance environments are presented to a device with this approach in order to probe the sensitivity to IF impedance variations. These investigations are performed on a 12 W LDMOS device characterised at 2.1 GHz within a purpose built, high-power measurement system, that allows the collection of both RF and IF voltage and current waveforms along with all associated impedances.
Keywords
intermediate-frequency amplifiers; modulation; power MOSFET; power amplifiers; active intermediate-frequency load-pull; current waveforms; electrical baseband induced memory effects; electrical memory; frequency 2.1 GHz; high-power LDMOS transistors; high-power measurement system; intermediate-frequency impedance environments; modulation frequency; multitone excitation; power 12 W; power amplifier bias insertion networks; Baseband; Frequency dependence; Frequency modulation; High power amplifiers; Linearity; Packaging; Power amplifiers; Power engineering and energy; Probes; Surface impedance;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2007. APMC 2007. Asia-Pacific
Conference_Location
Bangkok
Print_ISBN
978-1-4244-0748-4
Electronic_ISBN
978-1-4244-0749-1
Type
conf
DOI
10.1109/APMC.2007.4554737
Filename
4554737
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