Title :
Rapid electromagnetic analysis of multilayer interconnects
Author :
Heckmann, D. ; Dvorak, S.L. ; Cangellaris, A.C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
In this paper, a closed-form solution is presented for the individual elements of the impedance matrix generated by the application of the Method of Moments to the integral equation solution of shielded multiconductor structures. Using these expressions, impedance matrix fill time is reduced by one to four orders of magnitude.
Keywords :
UHF circuits; electric impedance; electromagnetism; integral equations; integrated circuit interconnections; matrix algebra; method of moments; microwave circuits; packaging; closed-form solution; electromagnetic analysis; impedance matrix; integral equation solution; matrix fill time reduction; method of moments; multilayer interconnects; rapid EM analysis; shielded multiconductor structures; Closed-form solution; Conducting materials; Dielectric substrates; Electromagnetic analysis; Impedance; Integral equations; Integrated circuit interconnections; Laboratories; Moment methods; Nonhomogeneous media;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634078
