• DocumentCode
    1975510
  • Title

    Reuse of EEE/WEEE in UK: Review on functionality of EEE/WEEE at the point of disposal

  • Author

    Dindarian, Azadeh ; Gibson, Andrew A P

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Univ. of Manchester, Manchester, UK
  • fYear
    2011
  • fDate
    16-18 May 2011
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The rapid growth in the electronics sector and use of technology in general has inevitably resulted in the generation of vast amounts of waste in the form of Electrical and Electronic Equipment (EEE). These wastes are often highly complex, integrated and toxic and consist of valuable substances such as gold and copper. Driven by legislation and economics the Waste of Electrical and Electronic Equipment (WEEE) recycling industry has improved its recycling rates, reduced the environmental impact of WEEE and increased efficiency in the recycling loop. However, a much more cost effective approach is to re-use WEEE or its sub-assembly components. The problem, dealt with in this paper, is that very little is known or understood about why consumers discard WEEE and its functionality at the point of disposal. Furthermore, if the proportion of re-use is to increase there has to be technical data about failure modes of equipment. This paper will review the functionality of the white household goods at the disposal point and its impact on the reuse rate as well as providing technical data on the failure modes of 100 microwave ovens.
  • Keywords
    environmental factors; recycling; electrical equipment waste; electronic equipment waste; electronics sector; environmental impact; recycling industry; recycling loop; recycling rate; Electronic waste; Microwave circuits; Microwave filters; Microwave ovens; Ovens; Recycling; Collection; Electronic waste; Functionality of products; Recycling; Reuse;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sustainable Systems and Technology (ISSST), 2011 IEEE International Symposium on
  • Conference_Location
    Chicago, IL
  • ISSN
    2157-524X
  • Print_ISBN
    978-1-61284-394-0
  • Type

    conf

  • DOI
    10.1109/ISSST.2011.5936867
  • Filename
    5936867