DocumentCode :
1975973
Title :
Fermilab-built SSC collider dipoles using low temperature curing insulation systems with and without glass tape
Author :
Jaffery, T.S. ; Coombes, R. ; Devred, A. ; DiMarco, J. ; Ogitsu, T. ; Sims, R.E. ; Tompkins, J.C. ; Wake, M. ; Bossert, R. ; Carson, J. ; Delchamps, S.W. ; Gonczy, I. ; Gourlay, S. ; Hanft, R. ; Lamm, M.J. ; Mazur, P. ; Orris, D. ; Strait, J.
Author_Institution :
Superconducting Super Collider Lab., Dallas, TX, USA
fYear :
1993
fDate :
17-20 May 1993
Firstpage :
2769
Abstract :
Polyimide with epoxy impregnated glass tape was used in Fermilab baseline design of several SSC Collider dipole magnets which were used in the SSC Accelerator Systems String Test (ASST). Later in the magnet R&D program several magnets were built using conductor insulation in which adhesive that cures at 140°C was coated directly on the polyimide film. Some alternate materials for coil end parts and coil winding were also tested. The data taken during the tests of these magnets are compared with results from 10-stack studies of the two insulation systems and design expectations and correlated with changes in assembly methods
Keywords :
beam handling equipment; proton accelerators; storage rings; synchrotrons; 10-stack studies; 140 C; Accelerator Systems String Test; SSC collider dipoles; coil end parts; coil winding; conductor insulation; epoxy impregnated glass tape; low temperature curing insulation systems; polyimide film; Coils; Conducting materials; Conductive films; Curing; Glass; Insulation; Magnets; Polyimides; System testing; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Particle Accelerator Conference, 1993., Proceedings of the 1993
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-1203-1
Type :
conf
DOI :
10.1109/PAC.1993.309455
Filename :
309455
Link To Document :
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