• DocumentCode
    1976290
  • Title

    Numerical analysis of the short-time current withstand performance of the DC circuit breaker

  • Author

    Hao Sun ; Haiyan Wang ; Delong Dong ; Chunping Niu ; Fei Yang ; Mingzhe Rong

  • Author_Institution
    State Key Lab. of Electr. Insulation for Power Equip., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Nowadays there is the requirement for the selective protection technology of the MCCB used in the DC power system. To achieve this goal it is necessary to improve the short-time current withstand performance of the MCCB. However, the experimental test on such a performance is quite time consuming. Therefore, it is very important to evaluate the short-time current withstand performance of the MCCB by means of simulation. In this paper a simulation model was established to describe the interaction process of the contact resistance, temperature rise, and the electro-dynamic force when the short current occurs. To be more specific, the time-varying of the nonlinear contact resistance due to the electro-dynamic force and the Joule heat are considered in the model. Based on the calculation, the temperature and the current density distribution versus time are obtained, which will be instructive and meaningful for the contact system design in the DCCB. Moreover, the simulation results have been verified by the experiment.
  • Keywords
    circuit breakers; contact resistance; current density; current distribution; heating; DC circuit breaker; Joule heating; MCCB; contact resistance; current density distribution; electrodynamic force; molded case circuit breaker; short time current withstand; temperature rise; Analytical models; Contact resistance; Finite element analysis; Force; Integrated circuit modeling; Power systems; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electric Power Equipment - Switching Technology (ICEPE-ST), 2013 2nd International Conference on
  • Conference_Location
    Matsue
  • Type

    conf

  • DOI
    10.1109/ICEPE-ST.2013.6804346
  • Filename
    6804346