DocumentCode
1976424
Title
Analysis of arc plasma during small capacitive current interruption in SF6 circuit breaker
Author
Liang Wang ; Xin Lin ; Feiming Wang ; Yan, Teiyi ; Jianyuan Xu
Author_Institution
Sch. of Electr. Eng., Shenyang Univ. of Technol., Shenyang, China
fYear
2013
fDate
20-23 Oct. 2013
Firstpage
1
Lastpage
4
Abstract
This paper establishes a model for the conductivity of non-equilibrium dual temperature arc plasma during small capacitive current interruption in a SF6 circuit breaker. Considering the contributions of electron-ion-neutral particle collision frequency and collision cross-section, we obtain the conductivity of SF6 plasma as a function of temperature and pressure and establish a dynamic arc model for small capacity currents. Based on the model, a numerical simulation is performed on the flow field with a load of small current of 1600 A for a 126 kV SF6 circuit breaker. Density, pressure and temperature distributions inside the circuit breaker chamber are obtained. With the electric field inside the same interrupter, dielectric recovery characteristic curves are described. In addition, the effect of arc duration on the dielectric recovery characteristics for small capacitive current is studied and the influence mechanism is discussed.
Keywords
SF6 insulation; circuit breakers; numerical analysis; plasma devices; temperature distribution; thermal conductivity; SF6 circuit breaker; arc duration effect; arc plasma analysis; circuit breaker chamber; collision cross-section; current 1600 A; dielectric recovery characteristic curves; dynamic arc model; electric field; electron-ion-neutral particle collision frequency; flow field; interrupter; nonequilibrium dual temperature arc plasma conductivity; numerical simulation; small capacitive current; small capacitive current interruption; temperature distributions; voltage 126 kV; Design automation; Electric breakdown; Numerical models; Plasmas; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Electric Power Equipment - Switching Technology (ICEPE-ST), 2013 2nd International Conference on
Conference_Location
Matsue
Type
conf
DOI
10.1109/ICEPE-ST.2013.6804352
Filename
6804352
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