DocumentCode :
1976631
Title :
Advanced model order reduction technique in real-life IC/package design
Author :
Peng, Zhen ; Shao, Yang ; Lee, Jin-Fa
Author_Institution :
Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
fYear :
2010
fDate :
7-9 Dec. 2010
Firstpage :
1
Lastpage :
4
Abstract :
An real-life packaging is a multi-port system with a wide band frequency of interest. The efficient solution of such multi-input/multi-output responses over a wide frequency band adds extraordinary computational complexity to Electromagnetic simulation. In this paper, we proposed an advance model order reduction (MOR) algorithm, that is capable of producing fast and accurate computation of multi-port multi-frequency responses. This MOR technique is based on a multipoint Galerkin asymptotic waveform evaluation (MGAWE) to automate the fast frequency sweep process, and a recycling Krylov subspaces method, GCRO-DR, to gain further efficiency and to reduce the needed matrix-vector (MV) multiplications required in solving DDM matrix equation at different frequencies with multi-port excitation. Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.
Keywords :
Galerkin method; computational complexity; frequency response; integrated circuit modelling; integrated circuit packaging; matrix multiplication; MGAWE; MOR technique; advanced model order reduction technique; computational complexity; electromagnetic simulation; fast frequency sweep process; matrix-vector multiplications; multipoint Galerkin asymptotic waveform evaluation; multiport excitation; multiport multifrequency responses; multiport system; real-life 3D full package signal integrity analysis; real-life IC-package design; recycling Krylov subspaces method; Equations; Integrated circuit modeling; Mathematical model; Moment methods; Recycling; Transmission line matrix methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
Conference_Location :
Singapore
ISSN :
2151-1225
Print_ISBN :
978-1-4244-9068-4
Electronic_ISBN :
2151-1225
Type :
conf
DOI :
10.1109/EDAPS.2010.5683000
Filename :
5683000
Link To Document :
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