DocumentCode :
1976648
Title :
Recent development of via models: Hybrid circuit and field analysis
Author :
Zhang, Yao-Jiang ; Fan, Jun
Author_Institution :
EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
fYear :
2010
fDate :
7-9 Dec. 2010
Firstpage :
1
Lastpage :
4
Abstract :
Via-plate interaction can be modeled as lumped circuits for vias and a two-dimensional field problem for the plate domain. The accuracy of the improved intrinsic via model and the conventional physics-based via model is investigated by comparing them with either analytical formula or numerical simulations for a via in a circular plate pair with various edge boundary conditions. It is found that the intrinsic via model matches very well with both the analytical formula and numerical solutions in all the examples studied. However, the physics-based via model is only an acceptable approximation at low frequencies and its accuracy is not dependent on the plate size but on the via itself. It is observed that the physics-based via model is more accurate for a plate par with smaller plate separations.
Keywords :
electronics packaging; numerical analysis; circular plate pair; edge boundary conditions; field analysis; hybrid circuit; lumped circuits; numerical simulations; physics-based via model; plate separations; via models; via-plate interaction; Accuracy; Analytical models; Boundary conditions; Impedance; Integrated circuit modeling; Numerical models; Probes; Hybrid circuit and field analysis; intrinsic via circuit model; physics-based via circuit model; via-plate interactions;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
Conference_Location :
Singapore
ISSN :
2151-1225
Print_ISBN :
978-1-4244-9068-4
Electronic_ISBN :
2151-1225
Type :
conf
DOI :
10.1109/EDAPS.2010.5683001
Filename :
5683001
Link To Document :
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