Augmented EPA with augmented EFIE method for packaging analysis

It is evident that the low frequency full wave electromagnetic modelling is necessary for IC packaging analysis. Considering the complexity, it is very difficult to solve the whole problem directly. Even though the domain decomposition method is a legitimate approach for these types of problems, the domain decomposition method based on the equivalence principle has the low frequency breakdown issue. In this paper, we developed a low frequency augmented equivalence principle algorithm (AEPA) with the augmented electric field integral equation (AEFIE) for packaging and IC analysis. On the equivalence surfaces, not only the electric current and the magnetic current, but also the electric charge and the magnetic charge are used to capture the low frequency couplings. Inside each AEPA box, AEFIE is applied to maintain the low frequency accuracy. As a result, we are able to solve low frequency domain decomposition problems and apply it to IC packaging analysis.