Title :
Thin Film Transfer Components for Cheap MICs
Author_Institution :
Department of Electrical and Electronic Engineering, Royal Military College of Science, Shrivenham, Swindon, SN6 8LA, England.
Abstract :
A solution to the problem of pattern definition, which sometimes exists in the production of cheap MICs, is described. The process (l) involves the transfer of high definition, thin film style, component patterns from a carrier to the main substrate. The concept allows common substrates to be tailored to individual requirements and promises the use of low cost MICs to be extended in frequency. The performance of components transferred into thick film and copper laminate style circuits is compared with wholly thin film constructed items.
Keywords :
Copper; Costs; Frequency; Laminates; Microwave integrated circuits; Production; Substrates; Thick films; Thin film circuits; Transistors;
Conference_Titel :
Microwave Conference, 1979. 9th European
Conference_Location :
Brighton, UK
DOI :
10.1109/EUMA.1979.332651
