Comparing flip-chip and wire-bond package effects on a receiver low-noise amplifier

Author

Lu, Kuan-Chung ; Horng, Tzyy-Sheng ; Han, Fu-Yi ; Cheng, Hung-Hsiang ; Chiu, Chi-Tsung ; Hung, Chih-Pin

Author_Institution

Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan

fYear

2010

fDate

7-9 Dec. 2010

Firstpage

1

Lastpage

4

Abstract

A comprehensive study based on chip-package co-modeling compares the effects between flip-chip ball-grid-array (FC-BGA) and wire-bond quad-flat-nonlead (WB-QFN) packages on a front-end cascode low-noise amplifier (LNA) in a 2.45 GHz CMOS wireless local area network (WLAN) receiver. In practical applications, the established package models are used to predict the degradation of figure of merit (FOM) for the cascode LNA under packaged condition. Chip-package co-modeling results achieve good agreement with measurements, and thus can persuasively account for the complete effects caused by the two different packages on the cascode LNA.

Keywords

CMOS analogue integrated circuits; UHF amplifiers; UHF integrated circuits; ball grid arrays; flip-chip devices; integrated circuit modelling; lead bonding; low noise amplifiers; radio receivers; wireless LAN; CMOS wireless local area network receiver; FC-BGA; cascode LNA; chip-package comodeling; flip-chip ball-grid-array; frequency 2.45 GHz; receiver low-noise amplifier; wire-bond package effects; wire-bond quad-flat-nonlead packages; CMOS integrated circuits; Impedance; Noise; Noise figure; Radiofrequency integrated circuits; Receivers; Wireless LAN;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE

Conference_Location

Singapore

ISSN

2151-1225

Print_ISBN

978-1-4244-9068-4

Electronic_ISBN

2151-1225

Type

conf

DOI

10.1109/EDAPS.2010.5683007

Filename

5683007