Overview of non-volatile memory packaging needs and approaches for space based systems

Author

Some, Raphael ; Minning, Charles P.

Author_Institution

Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA

fYear

1998

fDate

22-24 Jun 1998

Firstpage

14

Abstract

Summary form only given. Arguably, the most challenging requirements for the packaging of nonvolatile memories originates in the need for extremely low power/mass, high performance/reliability data storage in space based systems. Extremes in environmental factors including temperature, mechanical and thermal shock, and radiation are just some of the factors which the microelectronics package is required to deal with. This presentation presents some of the needs of the newest generation of spacecraft, as well as some of the approaches being used to package these mission critical components

Keywords

environmental degradation; integrated circuit packaging; integrated circuit reliability; integrated memory circuits; random-access storage; space vehicle electronics; thermal shock; environmental factors; environmental radiation; environmental temperature; extremely low mass data storage; extremely low power data storage; high performance data storage; high reliability data storage; mechanical shock; microelectronics package; mission critical components; nonvolatile memories; nonvolatile memory packaging; space based systems; spacecraft; thermal shock; Electric shock; Environmental factors; Microelectronics; Mission critical systems; Nonvolatile memory; Packaging; Power system reliability; Space vehicles; Temperature; Thermal factors;

fLanguage

English

Publisher

ieee

Conference_Titel

Nonvolatile Memory Technology Conference, 1998. 1998 Proceedings. Seventh Biennial IEEE

Conference_Location

Albuquerque, NM

Print_ISBN

0-7803-4518-5

Type

conf

DOI

10.1109/NVMT.1998.723207

Filename

723207