• DocumentCode
    1977125
  • Title

    Conformal shielding investigation for SiP modules

  • Author

    Huang, Chun-Hsiang ; Hsiao, Chih-Ying ; Wang, Chuen-De ; Chen, Tonny ; Kuo-Hsien, Liao ; Wu, Tzong-Lin

  • Author_Institution
    Dept. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2010
  • fDate
    7-9 Dec. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper proposes a complete testing process for conformal shielding techniques. The testing process is systemic and cheap for developing conformal shielding techniques. A 2-D experiment setup and an exact solution are presented to evaluate the properties of metals and metallization techniques. A test vehicle is designed for providing broad band source and low unintended noise. A experiment setup using giga-hertz transverse electromagnetic (GTEM) cell is proposed for providing low noise floor and high sensitivity for measuring small radiation. The test vehicle coated by 0.04 μm sputtering SuS and 1 μm sputtering copper is manufactured and measured to evaluate shielding effectiveness of conformal shielding.
  • Keywords
    TEM cells; copper; integrated circuit metallisation; system-in-package; SiP modules; broad band source; conformal shielding techniques; gigahertz transverse electromagnetic cell; low noise floor; low unintended noise; metallization techniques; sputtering copper; Copper; Metallization; TEM cells; Transmission line measurements; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
  • Conference_Location
    Singapore
  • ISSN
    2151-1225
  • Print_ISBN
    978-1-4244-9068-4
  • Electronic_ISBN
    2151-1225
  • Type

    conf

  • DOI
    10.1109/EDAPS.2010.5683022
  • Filename
    5683022