• DocumentCode
    1977215
  • Title

    A Market-in-Market Collaborative Model towards Application Marketplaces

  • Author

    Shih-Fang Chang

  • Author_Institution
    Syst. Integration Technol. Dept., Ind. Technol. Res. Inst., Hsinchu, Taiwan
  • fYear
    2013
  • fDate
    22-26 July 2013
  • Firstpage
    718
  • Lastpage
    719
  • Abstract
    Constructing application marketplace to supply mobile applications service is a new trend of service industry. The service operator establishes their own ecosystem with contracted software developers and content providers, and has cumulated a considerable sum of mobile applications in local market. However, the growth of each service is getting flatten and causes the service operators looking forward to new business model for expanding their territory. How to unite different proprietary application marketplace services and provide a seamless service experience to consumers is the challenge. In this work, we propose a market-in-market collaborative model for service platforms of application marketplaces, which allows a primary application marketplace having the ability to directly sell mobile applications of the secondary without physical mobile applications exchanged and uploaded in advance. We hope the proposed model can intelligently assist service providers to derive and establish more innovative cooperation solutions.
  • Keywords
    groupware; mobile computing; service industries; service-oriented architecture; application marketplace services; content providers; innovative cooperation solutions; market-in-market collaborative model; mobile applications service; seamless service experience; service industry; software developers; Collaboration; Computer architecture; Licenses; Mobile communication; Software as a service; Synchronization; application marketplace; market-in-market; service-oriented architecture; software as a service;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Software and Applications Conference (COMPSAC), 2013 IEEE 37th Annual
  • Conference_Location
    Kyoto
  • Type

    conf

  • DOI
    10.1109/COMPSAC.2013.115
  • Filename
    6649904