Title :
Performance analyse on millimetre-wave bonding-wire interconnection
Author :
Li, Jiankang ; Xiong, Yong-Zhong ; Hu, Sanming ; Goh, Wang Ling ; Hou, Debin ; Wu, Wen
Author_Institution :
Nanjing Univ. of Sci. & Technol., Nanjing, China
Abstract :
This paper presents a comprehensive analysis of the electrical performance of the bonding-wire interconnection up to 170 GHz. The effects of the wire length, loop height and pad area have all been analyzed. An electrical model for the bonding-wire is discussed. By reducing interconnection distance and optimizing pad area, the performance of the bonding-wire can be enhanced. The acceptable measurement results of the bonding-wire up to 170 GHz are obtained.
Keywords :
MIMIC; integrated circuit bonding; integrated circuit interconnections; lead bonding; electrical model; loop height; millimetre-wave bonding-wire interconnection; wire length effect; Bonding; Capacitance; Gold; Inductance; Integrated circuit interconnections; Scattering parameters; Wire;
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-9068-4
Electronic_ISBN :
2151-1225
DOI :
10.1109/EDAPS.2010.5683034
