• DocumentCode
    1977476
  • Title

    Simulation of arc in molded-case circuit breaker with metal vapor and moving electrode

  • Author

    Enami, Yasufumi ; Sakata, Masayoshi

  • Author_Institution
    Fuji Electr. Co., Ltd., Hino, Japan
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The behavior of arc in molded case circuit breaker is studied by computational fluid dynamics simulation (CFD) with moving electrode taking account of the metal vapor (Cu, Ag/W, Fe) and the decomposed gases (CO2, H2). The background fluid is air and the electric current is 820A DC. The circuit breaker consists of copper electrodes, arc runner, magnet, splitter plates and molded case. The mesh-morphing and re-meshing technique is used to represent the motion of electrode. With local thermal equilibrium (LTE) assumption, thermodynamic property of arc plasma is calculated by temperature, pressure, and gas composition. The simulation is performed by commercial software STAR-CCM+. It is shown that the motion of arc from electrode to arc runner is reproduced successfully, and the cooling effect of metal vapor has significant influence on the temperature of arc plasma.
  • Keywords
    arcs (electric); circuit breakers; computational fluid dynamics; copper; electric current; electrodes; iron; silver; thermodynamic properties; tungsten; CFD; CO2; Cu-Ag-W-Fe; H2; LTE; STAR-CCM+; arc plasma; arc runner; arc simulation; background fluid; computational fluid dynamics simulation; copper electrodes; current 820 A; decomposed gases; electric current; gas composition; local thermal equilibrium; magnet; mesh-morphing; metal vapor; molded-case circuit breaker; moving electrode; pressure; remeshing technique; splitter plates; temperature; thermodynamic property; Educational institutions; Europe; Iron; Solids; Switches; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electric Power Equipment - Switching Technology (ICEPE-ST), 2013 2nd International Conference on
  • Conference_Location
    Matsue
  • Type

    conf

  • DOI
    10.1109/ICEPE-ST.2013.6804390
  • Filename
    6804390