DocumentCode :
1977667
Title :
Concurrent analysis of self-heating effect and thermal stress in partially insulated field effect transistors (PiFETs)
Author :
Yi, Ming ; Yin, Wen-Yan
Author_Institution :
Center for Microwave & RF Technol., Shanghai Jiao Tong Univ., Shanghai, China
fYear :
2010
fDate :
7-9 Dec. 2010
Firstpage :
1
Lastpage :
4
Abstract :
A coupled electro-thermal-mechanical analysis of partially insulated field-effect transistors (PiFETs) is performed using the proposed hybrid nonlinear finite element method (FEM) with temperature-dependent parameters rigorously treated. The two major structures of PiFET, namely the partially insulating oxide (PiOX) under the drain and source (PUSD) and partially insulating oxide under the channel (PUC) structures are thoroughly studied. For comparison, the normal MOSFET and SOI FET are also investigated. The study of self-heating effect (SHE) in these devices indicates that the PiFET is more thermally efficient than conventional SOI device. Moreover, to fully investigate the SHE and SHE induce thermal stress, different choices of parameters related to PiOX are further studied and discussed.
Keywords :
MOSFET; finite element analysis; silicon-on-insulator; thermal stresses; FEM; MOSFET; PiFET; SOI FET; channel structure; coupled electrothermalmechanical analysis; hybrid nonlinear finite element method; partial insulated field effect transistors; partial insulating oxide; self-heating effect; temperature-dependent parameters; thermal stress; Electrodes; Equations; Heating; Mathematical model; Silicon on insulator technology; Stress; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
Conference_Location :
Singapore
ISSN :
2151-1225
Print_ISBN :
978-1-4244-9068-4
Electronic_ISBN :
2151-1225
Type :
conf
DOI :
10.1109/EDAPS.2010.5683047
Filename :
5683047
Link To Document :
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