DocumentCode
1977667
Title
Concurrent analysis of self-heating effect and thermal stress in partially insulated field effect transistors (PiFETs)
Author
Yi, Ming ; Yin, Wen-Yan
Author_Institution
Center for Microwave & RF Technol., Shanghai Jiao Tong Univ., Shanghai, China
fYear
2010
fDate
7-9 Dec. 2010
Firstpage
1
Lastpage
4
Abstract
A coupled electro-thermal-mechanical analysis of partially insulated field-effect transistors (PiFETs) is performed using the proposed hybrid nonlinear finite element method (FEM) with temperature-dependent parameters rigorously treated. The two major structures of PiFET, namely the partially insulating oxide (PiOX) under the drain and source (PUSD) and partially insulating oxide under the channel (PUC) structures are thoroughly studied. For comparison, the normal MOSFET and SOI FET are also investigated. The study of self-heating effect (SHE) in these devices indicates that the PiFET is more thermally efficient than conventional SOI device. Moreover, to fully investigate the SHE and SHE induce thermal stress, different choices of parameters related to PiOX are further studied and discussed.
Keywords
MOSFET; finite element analysis; silicon-on-insulator; thermal stresses; FEM; MOSFET; PiFET; SOI FET; channel structure; coupled electrothermalmechanical analysis; hybrid nonlinear finite element method; partial insulated field effect transistors; partial insulating oxide; self-heating effect; temperature-dependent parameters; thermal stress; Electrodes; Equations; Heating; Mathematical model; Silicon on insulator technology; Stress; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE
Conference_Location
Singapore
ISSN
2151-1225
Print_ISBN
978-1-4244-9068-4
Electronic_ISBN
2151-1225
Type
conf
DOI
10.1109/EDAPS.2010.5683047
Filename
5683047
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