Title :
Perspectives in microwave circuit analysis
Author_Institution :
Sch. of Electr. Eng., Cornell Univ., Ithaca, NY
Abstract :
It is shown that computational inefficiency can be avoided by combining the individual subnetworks two at a time, and calculating the S-parameters each time a connection is made, until the complete network is assembled. This technique, called the subnetwork growth method, has the advantage that no large sparse matrices are created. In making a connection there are two distinct operations, depending on whether the ports to be joined are on different networks or on the same network. Formulas for the new S-parameters can be calculated using signal flow graphs. To demonstrate the subnetwork growth method, a microstrip CAD package called Puff has been developed. The circuit description in Puff is stored as dynamic variables that are addressed using pointers. The process of laying out a network consists of building up a linked list of subnetworks and connections. In the analysis stage, Puff collapses these linked lists by making connections until no joints remain. To illustrate a practical design, a simple microstrip low-pass filter, namely a three-stage low-pass Tchebyscheff filter with a 0.1-dB ripple, is built
Keywords :
S-parameters; circuit analysis computing; computational complexity; low-pass filters; microwave filters; passive filters; software packages; strip line components; Puff; S-parameters; circuit description in Puff; computational inefficiency; linked list of subnetworks; microstrip CAD package; microstrip low-pass filter; microwave circuit analysis; practical design; signal flow graphs; stored as dynamic variables; subnetwork growth method; three-stage low-pass Tchebyscheff filter; Admittance; Circuit analysis; Distributed parameter circuits; Equations; Matrix converters; Microwave circuits; Microwave devices; Scattering parameters; Sparse matrices; Transmission line matrix methods;
Conference_Titel :
Circuits and Systems, 1989., Proceedings of the 32nd Midwest Symposium on
Conference_Location :
Champaign, IL
DOI :
10.1109/MWSCAS.1989.101955