DocumentCode :
1978844
Title :
Modelling of Elevated Coplanar Waveguides for High Speed Digital Interconnects
Author :
Kanthamani, S. ; Raju, S. ; Abhaikumar, V.
Author_Institution :
Dept. of ECE, Thiagarajar Coll. of Eng., Madurai
fYear :
2007
fDate :
11-14 Dec. 2007
Firstpage :
1
Lastpage :
4
Abstract :
In designing and manufacturing of high speed digital circuits it is important to develop a transmission line having characteristics of a higher phase velocity, higher impedance, low insertion loss. Elevated coplanar waveguide (ECPW) has been identified as the transmission line to achieve such characteristics. Mesh less based collocation method for analyzing the ECPW structure has been developed. The collocation method is a true mesh-less technique which scores the advantages of CPU time compared to conventional mesh methods. The Pertinent software code for implementation of analysis using collocation method has been written and implemented in Mat lab to estimate the quasi - static parameters such as characteristic impedance (Zo) and effective dielectric constant (epsivreff ) for various w/d ratios with CPU time of 216 sec. The RF performance of the equivalent circuit model results in a return loss of 20 dB at a frequency of 2.4 GHz.
Keywords :
coplanar transmission lines; coplanar waveguides; equivalent circuits; integrated circuit interconnections; permittivity; ECPW structure; Pertinent software code; dielectric constant; elevated coplanar waveguides; equivalent circuit model; frequency 2.4 GHz; high speed digital interconnects; loss 20 dB; mesh less based collocation method; mesh-less technique; quasi-static parameters; time 216 s; transmission line; Central Processing Unit; Coplanar transmission lines; Coplanar waveguides; Digital circuits; Distributed parameter circuits; Impedance; Insertion loss; Integrated circuit interconnections; Manufacturing; Propagation losses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2007. APMC 2007. Asia-Pacific
Conference_Location :
Bangkok
Print_ISBN :
978-1-4244-0748-4
Electronic_ISBN :
978-1-4244-0749-1
Type :
conf
DOI :
10.1109/APMC.2007.4554943
Filename :
4554943
Link To Document :
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