Title :
Thermal Characterization and Simulation of Packaged Medium Power Amplifier
Author :
Chaturvedi, Sandeep ; Koul, Shiban K. ; Saravanan, G. Sai
Author_Institution :
Gallium Arsenide Enabling Technol. Centre, Hyderabad
Abstract :
Heat management is a key issue in packaged Microwave active devices and circuits. Estimating the amount of heat generated in the packaged device is important in order to work out a suitable scheme for thermal management. This paper presents thermal characterization of a packaged medium power amplifier (Pd~1.8 W) working in C-Band. Junction temperature of the MMICs inside the package has been estimated using simple heat flow concepts. The measured results have been validated by thermal simulation of the packaged MPA with a commercial CFD simulator. Simulated and measured results are within 3-5% showing effectiveness of the calculations.
Keywords :
MMIC; power amplifiers; thermal management (packaging); heat management; junction temperature; packaged medium power amplifier; thermal characterization; Circuit simulation; Computational fluid dynamics; Electromagnetic heating; MMICs; Microwave circuits; Microwave devices; Packaging; Power amplifiers; Temperature; Thermal management;
Conference_Titel :
Microwave Conference, 2007. APMC 2007. Asia-Pacific
Conference_Location :
Bangkok
Print_ISBN :
978-1-4244-0748-4
Electronic_ISBN :
978-1-4244-0749-1
DOI :
10.1109/APMC.2007.4554947
