Title :
The Preparation and Characterization of a Compatibilizer: Silicon Dioxide Nanoparticles Grafted with L-Lactic Acid Oligomer
Author :
Houbin Li ; Xiaohui Zhang ; WenJuan Gu ; Xiaohui Zhang ; Shengping Yi ; Chi Huang
Author_Institution :
Sch. of Printing & Packaging, Wuhan Univ., Wuhan, China
Abstract :
It is found that the blending of inorganic materials and organic materials are usually thermodynamically immiscible with each other. The compatibility between the two blending materials can be enhanced by adding a component which is miscible with both parent materials. Therefore, the as-synthesized silicon dioxide grated by L-lactic acid (OLLA-g-SiO2) was used as a compatibilizer to enhance the compatibility of the PLLA and silicon dioxide (SiO2). In the paper, we prepared OLLA-g-SiO2 by using Tin (II) 2-octanoate Sn(Oct)2 as catalyst. Meanwhile, the surface-grafting reaction was characterized by Fourier transform infrared spectrometry (FTIR) and thermogravimetric analysis (TG). We also studied the mechanical properties of the composite PLLA/OLLA-g-SiO2/SiO2 films which can be used as package materials. It was found that the tensile strength of PLLA/SiO2 films could still be kept when OLLA-g-SiO2 were introduced, even if there were a large amount of SiO2 nanoparticles (>10 wt%) during blending. So the OLLA-g-SiO2 could be used as a compatibilizer in the films prepared by blending PLLA with SiO2.
Keywords :
biodegradable materials; blending; chemical technology; infrared spectroscopy; organic compounds; polymer blends; silicon compounds; thermal analysis; Fourier transform infrared spectrometry; L-lactic acid oligomer; SiO2; blending materials; compatibilizer characterization; compatibilizer preparation; inorganic materials; silicon dioxide nanoparticles; surface-grafting reaction; thermogravimetric analysis; Fourier transforms; Infrared spectra; Inorganic materials; Mechanical factors; Nanoparticles; Organic materials; Packaging; Silicon compounds; Spectroscopy; Tin; OLLA-g-SiO2; PLLA; SiO2; compatibilizer;
Conference_Titel :
Computer Science and Software Engineering, 2008 International Conference on
Conference_Location :
Wuhan, Hubei
Print_ISBN :
978-0-7695-3336-0
DOI :
10.1109/CSSE.2008.603