Title :
Effect of RF power level on the arc-TiO2 dense film for dye-sensitized solar cell performance
Author :
Abdullah, Mohd Harun ; Ishak, A. ; Saurdi, I. ; Rusop, M.
Author_Institution :
Nano-Electron. Centre (NET), Univ. Teknol. MARA (UiTM), Shah Alam, Malaysia
Abstract :
Graded index TiO2 compact layer (arc-TiO2) that improved transmittance and reduced electron recombination in dye-sensitized solar cell (DSSC) is employed by RF sputtering. Effects of arc-TiO2 prepared at various RF sputtering power to the performances of DSSC were investigated by means of open-circuit voltage decay (OCVD) and electrochemical impedance spectroscopy (EIS). The slow decay behaviour of the photo-voltage attributed to the desirable merits of the arc-TiO2 compact layer has been evidence by the OCVD measurement. The improvement of adhesion between arc-TiO2 film and porous-TiO2 has decrease the interfacial-charge resistance R1 in the EIS measurement, thus facilitating the charge-transfer process of the electron in the DSSC. A remarkable improvement in the overall conversion efficiency has been achieved at 100 W of RF power, representing almost 42 % increment compared to the cell without the compact layer is mainly due to the higher and red-shifted transmittance peaks, and also the ability to reduce the charge recombination in the DSSC.
Keywords :
charge exchange; electrochemical impedance spectroscopy; solar cells; sputter deposition; titanium compounds; DSSC; EIS; OCVD; RF power level; RF sputtering; TiO2; adhesion; arc-titanium dioxide dense film; charge recombination reduction; charge-transfer process; dye-sensitized solar cell performance; electrochemical impedance spectroscopy; electron recombination reduction; interfacial-charge resistance; open-circuit voltage decay; photo-voltage decay behaviour; red-shifted transmittance peaks; Decision support systems; Electrodes; Films; Indium tin oxide; Photovoltaic cells; Radio frequency; Substrates; Compact layer; Open-circuit voltage decay; Recombination; interfacial-charge resistance;
Conference_Titel :
System Engineering and Technology (ICSET), 2013 IEEE 3rd International Conference on
Conference_Location :
Shah Alam
Print_ISBN :
978-1-4799-1028-1
DOI :
10.1109/ICSEngT.2013.6650200