Title :
Improved aging results using thick-film hybrid packaging and evacuated miniature ovenized oscillators using such packaging
Author :
Clark, R.L. ; Li, J. ; Adler, J.
Author_Institution :
Vectron Int., Norwalk, CT, USA
Abstract :
Aging performance using hybrid thick-film packaging of oscillator assemblies comparable to individually packaged resonator assemblies is described in this paper. Achieving this level of aging performance has allowed for the practical realization of evacuated open-blank ovenized oscillators
Keywords :
ageing; crystal oscillators; packaging; aging; evacuated miniature ovenized oscillators; evacuated open-blank oscillators; thick-film hybrid packaging; Aging; Assembly; Ceramics; Conducting materials; Electronic packaging thermal management; Electronics packaging; Insulation; Oscillators; Thermal conductivity; Welding;
Conference_Titel :
Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European
Conference_Location :
Besancon
Print_ISBN :
0-7803-5400-1
DOI :
10.1109/FREQ.1999.840796
