Title :
Evaluation of Conductivity of Sandwich-type Dielectric Substrates in Millimeter Wave Region and Comparison with Copper-clad Dielectric Substrates
Author :
Tran Thi Huong ; Hirolkawa, Jiro ; Kogami, Yoshinori ; Ando, Makoto
Author_Institution :
Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Tokyo
Abstract :
This paper presents a measurement method for conductivity of sandwich-type dielectric substrates in millimeter wave region. In this method, the conductivity is evaluated from the measured resonant characteristics of Whispering Gallery modes in a circular disk sample. The method has an advantage for millimeter wave measurement in terms of the size of resonators with the diameter is about 20~40 times of wavelength. The WG mode resonances can be arisen periodically in order of the mode number in a wide frequency band. We present the measured conductivity of the sandwich-type dielectric substrates with three types of copper foils and compare with the results of copper-clad dielectric substrates in 50- 65 GHz band. The result of conductivity of electrodeposited copper foil is 53% to 60% of conductivity of pure copper and the results of rolled copper foils and both side shinning copper foils is 63% to 71%. These results are almost equal to the results obtained by the use of copper-clad resonator.
Keywords :
copper; dielectric materials; dielectric resonators; electrical conductivity measurement; millimetre wave measurement; substrates; circular disk sample; copper foils; copper-clad dielectric substrates; copper-clad resonator; electrodeposited copper foil; millimeter wave measurement; millimeter wave region; rolled copper foils; sandwich-type dielectric substrates; shinning copper foils; whispering gallery modes; Conductivity measurement; Copper; Dielectric measurements; Dielectric substrates; Millimeter wave measurements; Millimeter wave technology; Resonance; Size measurement; Wavelength measurement; Whispering gallery modes;
Conference_Titel :
Microwave Conference, 2007. APMC 2007. Asia-Pacific
Conference_Location :
Bangkok
Print_ISBN :
978-1-4244-0748-4
Electronic_ISBN :
978-1-4244-0749-1
DOI :
10.1109/APMC.2007.4555027