PEMs: they are used successfully in Hi-Rel avionics

Author

Fink, John

Author_Institution

Honeywell, Coon Rapids, MN, USA

Volume

1

fYear

1999

fDate

1999

Firstpage

540

Abstract

The decision of integrated circuit manufacturers to concentrate all of their activity on the production of components for the consumer industry has caused considerable and escalating difficulty for those OEM manufacturers who produce products which must work in extended temperature range applications. This has raised issues relative to the reliability and availability of products which are used outside their data sheet specifications. It has also raised issues about how to maintain products which are in service when the source of supply for the replacement parts has disappeared. This situation has also motivated considerable progress towards cooperative action among the OEM manufacturers of this type of equipment, where the expectation is that the combined requirements and resources can reduce the magnitude of the problem

Keywords

encapsulation; integrated circuit packaging; integrated circuit reliability; military avionics; plastic packaging; surface mount technology; thermal management (packaging); OEM manufacturers; SMT; cooperative action; extended temperature range applications; field failure; hermetic parts; high-reliability avionics; plastic encapsulated microcircuits; quality assessment; replacement parts supply; Aerospace electronics; Application specific integrated circuits; Business; Defense industry; Integrated circuit manufacture; Integrated circuit reliability; Manufacturing industries; Plastics; Production; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European

Conference_Location

Besancon

ISSN

1075-6787

Print_ISBN

0-7803-5400-1

Type

conf

DOI

10.1109/FREQ.1999.840824

Filename

840824