Title :
High density packaging of flash memory
Author_Institution :
Irvine Sensors Corp., Costa Mesa, CA, USA
Abstract :
The next innovation in three-dimensional (3D) packaging is heterogeneous stacks containing all of the components for a complete system or subsystem. The stack is constructed using known good die (KGD), and provides a high level of integration and interconnectivity. This packaging technology lends itself to flash memory and DRAM mass storage, as well as complete computers and other complex systems
Keywords :
DRAM chips; flash memories; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; 3D packaging; DRAM mass storage; flash memory; heterogeneous stacks; high density packaging; known good die; package integration level; package interconnectivity; packaging technology; subsystem components; Buildings; Ceramics; Flash memory; Logic; Packaging; Random access memory; Sensor systems; Silicon; Technological innovation; Telephony;
Conference_Titel :
Nonvolatile Memory Technology Conference, 1998. 1998 Proceedings. Seventh Biennial IEEE
Conference_Location :
Albuquerque, NM
Print_ISBN :
0-7803-4518-5
DOI :
10.1109/NVMT.1998.723228
