Title :
An all-printed passive component technology for low-cost RFID
Author :
Redinger D ; Farshchi, R. ; Subramanian, V.
Author_Institution :
EECS Dept., California Univ., Berkeley, CA, USA
Abstract :
In this paper, we demonstrate an all-printed passive component technology on plastic, including inductors, capacitors, and multilevel interconnects. This represents an important step towards the development of ultra-low-cost RFID on plastic.
Keywords :
capacitors; identification technology; inductors; integrated circuit interconnections; passive networks; radio applications; capacitors; inductors; multilevel interconnects; printed passive component; ultra-low-cost RFID; Annealing; Capacitors; Conductors; Dielectric substrates; Gold; Inductors; Plastics; Polyimides; Printing; Radiofrequency identification;
Conference_Titel :
Device Research Conference, 2003
Conference_Location :
Salt Lake City, UT, USA
Print_ISBN :
0-7803-7727-3
DOI :
10.1109/DRC.2003.1226926
