DocumentCode
1981707
Title
Fuzzy control for one kind of curing process
Author
XinJiang, Lu ; Han-Xiong, Li
Author_Institution
Dept. of Manuf. Eng & Eng Manage., City Univ. of Hong Kong, Hong Kong
fYear
2009
fDate
11-13 May 2009
Firstpage
66
Lastpage
70
Abstract
In this paper, fuzzy control is proposed to control one kind of nonlinear curing process. The nonlinear curing process is firstly approximately modeled by the T-S fuzzy model, upon which fuzzy control is designed to guarantee the process stability and achieve the Hinfin tracking performance. Finally, the proposed method is applied to control the temperature profile of a practical curing process.
Keywords
Hinfin control; curing; electronics packaging; fuzzy control; stability; temperature control; Hinfin tracking; T-S fuzzy model; fuzzy control; nonlinear curing process; process stability; semiconductor packaging industry; temperature profile control; Control systems; Curing; Fuzzy control; Fuzzy logic; Fuzzy systems; Heat transfer; Nonlinear control systems; Packaging; Process control; Temperature control; Curing process; Fuzzy control; Process control; Robust control; T-S model;
fLanguage
English
Publisher
ieee
Conference_Titel
Computational Intelligence for Measurement Systems and Applications, 2009. CIMSA '09. IEEE International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-3819-8
Electronic_ISBN
978-1-4244-3820-4
Type
conf
DOI
10.1109/CIMSA.2009.5069920
Filename
5069920
Link To Document