DocumentCode :
1982415
Title :
Wideband Lumped Element Model for On-Chip (A)symmetrical Coupled Interconnects on Lossy Silicon Substrate
Author :
Yang, Kai ; Yin, Wen-Yan ; Mao, Jun-Fa
Author_Institution :
Sch. of Electron. Inf. & Electr. Eng., Shanghai Jiao Tong Univ., Shanghai
fYear :
2007
fDate :
11-14 Dec. 2007
Firstpage :
1
Lastpage :
4
Abstract :
This paper presents a fully lumped element model to describe on-chip symmetrical and asymmetrical coupled transmission lines on silicon substrate. The current methodology is based on the modeling of "c" and " pi " mode wave propagated in the coupled interconnects respectively, in which the lumped elements are extracted using rigorous frequency asymptotic technique without any optimization. In our model, all the parasitic effects, such as substrate and conductor loss, are treated appropriately. The equivalent frequency-independent lumped model is derived and verified with the S parameters from EM simulation. The frequency responses of the proposed model express quite good agreement with those obtained from commercial EM software up to 40 GHz with scalability of line length ranged from 500 um to 4 mm.
Keywords :
S-parameters; coupled transmission lines; elemental semiconductors; frequency response; lumped parameter networks; EM simulation; S parameters; Si; equivalent frequency-independent lumped model; frequency responses; lossy silicon substrate; on-chip asymmetrical coupled interconnects; rigorous frequency asymptotic technique; wideband lumped element model; Coupling circuits; Equations; Frequency; Integrated circuit interconnections; Propagation losses; Scattering parameters; Semiconductor device modeling; Silicon; Transmission lines; Wideband; Asymmetrical and symmetrical coupled transmission lines; Modeling; frequency independent; lumped element model; wideband;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2007. APMC 2007. Asia-Pacific
Conference_Location :
Bangkok
Print_ISBN :
978-1-4244-0748-4
Electronic_ISBN :
978-1-4244-0749-1
Type :
conf
DOI :
10.1109/APMC.2007.4555109
Filename :
4555109
Link To Document :
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