DocumentCode
1982537
Title
Ultra Wideband Vias and Power Dividers in Microstrip-Slot Technology
Author
Seman, Norhudah ; Bialkowski, Marek E. ; Khor, Wee Chang
Author_Institution
Sch. of Inf. Technol. & Electr. Eng., Univ. of Queensland, St. Lucia, QLD
fYear
2007
fDate
11-14 Dec. 2007
Firstpage
1
Lastpage
4
Abstract
The design of ultra-wideband vias and power dividers in microstrip-slot technology is presented. The devices employ two substrates supported by a common ground plane. Their design is accomplished with the use of commercially available full EM analysis and design software. Low insertion loss and good return loss performances over an ultra wide frequency band for the designed structures are noted.
Keywords
electromagnetic waves; microstrip circuits; power dividers; EM analysis; design software; microstrip slot technology; power dividers; ultra wideband vias; Frequency; Insertion loss; Integrated circuit interconnections; Microstrip; Microwave circuits; Microwave technology; Nonhomogeneous media; Power dividers; Slotline; Ultra wideband technology; component; microstrip; multilayer; power divider; slotline; via;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2007. APMC 2007. Asia-Pacific
Conference_Location
Bangkok
Print_ISBN
978-1-4244-0748-4
Electronic_ISBN
978-1-4244-0749-1
Type
conf
DOI
10.1109/APMC.2007.4555115
Filename
4555115
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