DocumentCode
1982708
Title
Dielectrophoretic micro/nanoassembly with microtweezers and nanoelectrodes
Author
Subramanian, Arunkumar ; Vikramaditya, Barmeshwar ; Nelson, Bradley J. ; Bell, Dominik ; Dong, Lixin
Author_Institution
Inst. of Robotics & Intelligent Syst., Swiss Fed. Inst. of Technol.
fYear
2005
fDate
18-20 July 2005
Firstpage
208
Lastpage
215
Abstract
The contact phase of an assembly task involving micro and nano-sized building blocks is complicated by the presence of surface and intermolecular forces such as electrostatic, surface-tension and Van der Waals forces. Assembly strategies must account for the presence of these forces in order to guarantee successful repeatable micro and nanoassembly with high precision. In this paper, a detailed model is presented for the electrostatic interactions at these scales and qualitatively analyzed. Based on the results of this analysis, dielectrophoretic assembly principles of MEMS/NEMS devices are proposed and experimentally verified with microtweezers for microscale Ni parts and with nanoelectrodes fabricated by electron-beam lithography for carbon nanotube assembly. The successful manipulation and assembly of carbon nanotubes using dielectrophoretic forces produced by nanoelectrodes will lead to a higher integration of CNTs into both nanoelectronics and NEMS
Keywords
electrostatics; microassembling; micromechanical devices; nanoelectronics; van der Waals forces; MEMS; NEMS; Van der Waals forces; carbon nanotube assembly; dielectrophoresis; dielectrophoretic microassembly; dielectrophoretic nanoassembly; electron-beam lithography; electrostatics; intermolecular forces; microtweezers; nanoelectrodes; surface tension; Carbon nanotubes; Dielectrophoresis; Electrostatics; Iris; Micromechanical devices; Nanoelectromechanical systems; Path planning; Robotic assembly; Self-assembly; Telephony;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Robotics, 2005. ICAR '05. Proceedings., 12th International Conference on
Conference_Location
Seattle, WA
Print_ISBN
0-7803-9178-0
Type
conf
DOI
10.1109/ICAR.2005.1507414
Filename
1507414
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