Title :
Fast Solution of Scattering from Conducting Structures by Local MLFMA Based on Improved Electric Field Integral Equation
Author :
Jun, Tian Li ; Zaiping, Nie ; Lin, Lei ; Tian Li Jun
Author_Institution :
Coll. of Electron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu
Abstract :
In this paper local multilevel fast multipole algorithm(LMLFMA) based on a novel improved electric field integral equation (IEFIE) is developed to achieve fast and efficient solution of electromagnetic scattering from 3D conducting structures. A well-conditioned matrix is constructed in the IEFIE by adding the principle value term of magnetic field integral equation (MFIE) operator into traditional EFIE operator. Only several update steps for the current vector are required to attain a reasonable solution. To further speed up the computation of matrix-vector multiplications in the iteration, LMLFMA is applied. The present method attains much faster convergence of iteration than traditional EFIE and less computational complexity of matrix-vector multiplications than MLFMA, and it still keeps good accuracy. Numerical results show the validity and efficiency of the present method.
Keywords :
computational complexity; electric field integral equations; electromagnetic wave scattering; iterative methods; magnetic field integral equations; matrix algebra; 3D conducting structures; MLFMA; computational complexity; conducting structures; electromagnetic scattering; improved electric field integral equation; local multilevel fast multipole algorithm; magnetic field integral equation; matrix-vector multiplications; scattering solution; Computational complexity; Educational institutions; Electromagnetic scattering; Geometry; Green function; Integral equations; MLFMA; Magnetic fields; Microwave technology; Surface treatment; conjugate gradient; integral equation; local interaction; multilevel fast multipole algorithm; scattering;
Conference_Titel :
Microwave Conference, 2007. APMC 2007. Asia-Pacific
Conference_Location :
Bangkok
Print_ISBN :
978-1-4244-0748-4
Electronic_ISBN :
978-1-4244-0749-1
DOI :
10.1109/APMC.2007.4555146