Title :
Silicon single crystalline MEMS shunt contact switch for RF application
Author :
Aharon, Oren ; Feldman, Shai ; Nemirovsky, Yael
Author_Institution :
Facultv of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
Abstract :
A micro-electro-mechanical (MEMS) DC to RF shunt switch was fabricated using a bulk micromachining process for single crystal silicon. The switch was vertically integrated to a microwave circuit using flip-chip bonding technology. The pull-in voltage and switching time were measured. Also, RF characterization of switch states was performed. This new design offers the potential for a high power applications switch. The concept of the described packaged switch offers a stand alone switch, which is not dependent on substrate material or technology.
Keywords :
flip-chip devices; micromachining; microswitches; microwave integrated circuits; microwave switches; MEMS shunt contact switch; RF characterization; Si; bulk micromachining process; flip-chip bonding technology; high power switch; microwave integrated circuit; pull-in voltage; silicon single crystal MEMS switch; stand alone switch; switching time; Bonding; Contacts; Crystallization; Integrated circuit technology; Micromachining; Micromechanical devices; Radio frequency; Silicon; Switches; Switching circuits;
Conference_Titel :
Electrical and Electronics Engineers in Israel, 2004. Proceedings. 2004 23rd IEEE Convention of
Print_ISBN :
0-7803-8427-X
DOI :
10.1109/EEEI.2004.1361146
