DocumentCode
1984562
Title
Laser crack-free cutting technique for thick and dense ceramics
Author
Ji, Lingfei ; Yan, Yinzhou ; Bao, Yong ; Jiang, Yijian
Author_Institution
Inst. of Laser Eng., Beijing Univ. of Technol., Beijing, China
fYear
2009
fDate
30-3 Aug. 2009
Firstpage
1
Lastpage
2
Abstract
A new laser crack-free cutting technique for dense ceramics with thickness of ges 10 mm based on beam continuous piercing full through the workpieces is presented. The techology can be concluded as a feasible tool for cutting of thick and dense ceramics in complex path, even for 3D cutting.
Keywords
ceramics; laser beam cutting; 3D cutting; dense ceramic; laser crack free cutting technique; size 10 mm; thick ceramic; Aluminum oxide; Ceramics; Laser beam cutting; Laser modes; Optical materials; Optical pulses; Optical surface waves; Rough surfaces; Surface cracks; Surface roughness; crack-free; laser cutting; thick ceramics;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers & Electro Optics & The Pacific Rim Conference on Lasers and Electro-Optics, 2009. CLEO/PACIFIC RIM '09. Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-3829-7
Electronic_ISBN
978-1-4244-3830-3
Type
conf
DOI
10.1109/CLEOPR.2009.5292746
Filename
5292746
Link To Document