DocumentCode :
1984864
Title :
Building blocks for digital wireless communications in sub-micron technologies: an overview
Author :
Finol, Jesus L. ; Durec, Jeffrey C. ; Lovelace, David K.
Author_Institution :
Motorola Semicond. Products Sector, Tempe, AZ, USA
fYear :
1998
fDate :
2-4 Mar 1998
Firstpage :
113
Lastpage :
126
Abstract :
This paper presents an overview of both the basic building blocks and process technologies associated with silicon ICs for personal wireless communications. The technical challenges to achieve higher levels of RF monolithic integration at a low cost and with low power dissipation in battery-powered portable transceivers are presented. Specific emphasis will be given to applications in the 1 to 2 GHz range of carrier frequencies
Keywords :
digital integrated circuits; digital radio; elemental semiconductors; low-power electronics; mobile radio; monolithic integrated circuits; silicon; transceivers; 1 to 2 GHz; RF monolithic integration; Si; battery powered portable transceiver; building block; cost; personal digital wireless communication; power dissipation; silicon IC; submicron process technology; BiCMOS integrated circuits; CMOS technology; Communication standards; Communications technology; Costs; Integrated circuit technology; Monolithic integrated circuits; Radio frequency; Silicon; Wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Devices, Circuits and Systems, 1998. Proceedings of the 1998 Second IEEE International Caracas Conference on
Conference_Location :
Isla de Margarita
Print_ISBN :
0-7803-4434-0
Type :
conf
DOI :
10.1109/ICCDCS.1998.705818
Filename :
705818
Link To Document :
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