Title :
Fabrication of a reflective mirror within wide incidence angles for mid-infrared wavelength
Author :
Miao, Fengjuan ; Zhang, Jie ; Xu, Shaohui ; Wang, Lianwei ; Chu, Junhao ; Cao, Zhishen ; Zhan, Peng ; Zhenlin Wang
Author_Institution :
Dept. of Electron. Eng., East China Normal Univ., Shanghai
Abstract :
One-dimensional (1-D) photonic crystal with photonic band-gap based on porous silicon is fabricated with alternative etching currents during anodization. The microstructure was characterized by scanning electron microscopy and the optical reflectance spectra by Fourier transform infrared spectroscopy. A band-gap centered at 6 microns with a bandwidth of 3 microns has been successfully obtained. The prepared multilayer structure can reflect mid-infrared within a wide incidence angle up to 50deg. After proper oxidation process, its thermal properties can be improved significantly, and meanwhile the band-gap only slightly shifts to that centered at 5.7 microns. PECVD of Si3N4 is employed to improve the surface morphology in order to make the structure suitable to the fabrication of sensors. It is found that deposition of Si3N4 does not change the reflectance properties of the structures.
Keywords :
etching; light reflection; mirrors; optical fabrication; photonic crystals; plasma CVD coatings; scanning electron microscopy; silicon; surface morphology; thermal properties; 1D photonic crystal; Fourier transform infrared spectroscopy; PECVD; Si; alternative etching currents; microstructure; midinfrared wavelength; multilayer structure; optical reflectance spectra; photonic band-gap; porous silicon; reflective mirror fabrication; scanning electron microscopy; surface morphology; thermal property; wide incidence angle; Electrons; Etching; Microstructure; Mirrors; Optical device fabrication; Optical microscopy; Photonic band gap; Photonic crystals; Reflectivity; Silicon; FTIR; PECVD of Si3N4; anodization; multilayer structure; oxidation; wide angle;
Conference_Titel :
Metamaterials, 2008 International Workshop on
Conference_Location :
Nanjing
Print_ISBN :
978-1-4244-2608-9
Electronic_ISBN :
978-1-4244-2609-6
DOI :
10.1109/META.2008.4723568